 |
Find a Complete Patent Family Using Derwent World Patents Index?
TOPIC: In this example, using Derwent World Patents Index® (File 351), you want to obtain 1) all patents that share the same priority application number and 2) the complete patent family for U.S. patent 7089659. A Derwent family includes all patent documents (patent applications and issued patents) that share the same priority application number as the "basic" or first published patent loaded into DWPI.
To retrieve all related patents, you can use the MAP command to map priority application numbers. MAP creates a SearchSave using the data extracted from a specified field in a set of records.
COMMAND SUMMARY
BEGIN 351
SELECT PN=US 7089659
TYPE S1/3/ALL
MAP ANPR T
EXS
MAP ANPR T
EXS
TYPE S#/3/ALL
HOW TO...
1. After entering BEGIN 351 to open DWPI for searching, SELECT the patent number (pn=).
|
?b 351
[File 351] Derwent WPI 1963-2006/UD,UM &UP=200629
(c) 2006 Thomson Derwent. All rights reserved.
?SELECT PN=US 7089659
S1 1 SELECT PN=US 7089659 |
2. TYPE the set in Format 3 to see the patent family members.
|
?t s1/3/all
1/3/1
DIALOG(R)File 351:Derwent WPI
(c) 2007 The Thomson Corporation. All rts. reserv.
0013017102 - Drawing available
WPI ACC NO: 2003-095697/200309
Related WPI Acc No: 2005-001784; 2005-022879
XRAM Acc No: C2003-024333
XRPX Acc No: N2003-075883
Production of ceramic laminates for electronic parts, involves
forming ceramic green sheet, printing electrically conducting
patterns and ceramic patterns on the green sheet, and
laminating green sheets
Patent Assignee: KYOCERA CORP (KYOC)
Inventor: IWAIDA T; KOIZUMI S
Patent Family (10 patents, 4 countries)
Patent Application
Number Kind Date Number Kind Date Update
GB 2376207 A 20021211 GB 200212030 A 20020524 200309 B
JP 2002353625 A 20021206 JP 2001157699 A 20010525 200310 E
US 20030016484 A1 20030123 US 2002155702 A 20020524 200310 E
JP 2003017356 A 20030117 JP 2001197119 A 20010628 200317 E
JP 2003051675 A 20030221 JP 2001236376 A 20010803 200323 E
CN 1423288 A 20030611 CN 2002130393 A 20020525 200357 E
JP 3527899 B2 20040517 JP 2001197119 A 20010628 200433 E
GB 2376207 B 20050330 200523 E
JP 3726035 B2 20051214 JP 2001157699 A 20010525 200582 E
US 7089659 B2 20060815 US 2002155702 A 20020524 200654 E
Priority Applications (no., kind, date): JP 2001197119 A 20010628;
JP 2001157699 A 20010525; JP 2001236376 A 20010803
Patent Details
Number Kind Lan Pg Dwg Filing Notes
GB 2376207 A EN 81 9
JP 2002353625 A JA 9
JP 2003017356 A JA 10
JP 2003051675 A JA 9
JP 3527899 B2 JA 10 Previously issued patent JP 2003017356
JP 3726035 B2 JA 14 Previously issued patent JP 2002353625
|
Part 2
3. Use the MAP command to extract all priority application numbers from S1 and create a temporary SearchSave.
4. Execute (EXS) the SearchSave to create a set of all priority application numbers from Set 1 (S2).
Note: Set 2 contains three unique priority application numbers.
5. MAP the priority application numbers until you come up with the same number of records.
|
?MAP ANPR T
Temp SearchSave "TD495" stored
1 Select Statement, 3 Search Term(s)
SearchSave TD495
1 SearchSave(s), 3 Search Term(s)
?EXS
Executing TD495
3 AN=JP 2001157699
3 AN=JP 2001197119
3 AN=JP 2001236376
S2 3 AN=JP 2001157699 + AN=JP 2001197119 +
AN=JP 2001236376
?MAP ANPR T
Temp SearchSave "TD496" stored
1 Select Statement, 3 Search Term(s)
SearchSave TD496
1 SearchSave(s), 3 Search Term(s)
?EXS
Executing TD495
3 AN=JP 2001157699
3 AN=JP 2001197119
3 AN=JP 2001236376
S2 3 AN=JP 2001157699 + AN=JP 2001197119 +
AN=JP 2001236376
|
6. TYPE all records in Format 3 to see the patents for the family members.
|
?T S3/3/ALL
2/3/1
DIALOG(R)File 351:Derwent WPI
(c) 2007 The Thomson Corporation. All rts. reserv.
0014675296 - Drawing available
WPI ACC NO: 2005-022879/
Related WPI Acc No: 2003-095697; 2005-001784
XRAM Acc No: C2005-007657
XRPX Acc No: N2005-019743
Production of ceramic laminates for electronic components comprises
forming electrically conducting patterns, forming organic resin film
on upper surface of ceramic green sheet, and forming ceramic patterns
on film
Patent Assignee: KYOCERA CORP (KYOC)
Inventor: IWAIDA T; KOIZUMI S
Patent Family (2 patents, 1 countries)
Patent Application
Number Kind Date Number Kind Date Update
GB 2402103 A 20041201 GB 200212030 A 20020524 200503 B
GB 200419635 A 20040903
GB 2402103 B 20050330 200523 E
Priority Applications (no., kind, date): JP 2001197119 A 20010628; JP
2001157699 A 20010525; JP 2001236376 A 20010803
Patent Details
Number Kind Lan Pg Dwg Filing Notes
GB 2402103 A EN 73 9 Division of application GB 200212030
2/3/2
DIALOG(R)File 351:Derwent WPI
(c) 2007 The Thomson Corporation. All rts. reserv.
0014654204 - Drawing available
WPI ACC NO: 2005-001784/200501
Related WPI Acc No: 2003-095697; 2005-022879
XRAM Acc No: C2005-001219
XRPX Acc No: N2005-001777
Laminated ceramic capacitor for use in electronic device, has inner
electrode layer-extending portions and inner electrode layers
forming flush surface, and dielectric ceramic layers in non-capacity
portions, formed by ceramics
Patent Assignee: KYOCERA CORP (KYOC)
Inventor: IWAIDA T; KOIZUMI S
Patent Family (2 patents, 1 countries)
Patent Application
Number Kind Date Number Kind Date Update
GB 2402102 A 20041201 GB 200212030 A 20020524 200501 B
GB 200419632 A 20040903
GB 2402102 B 20050330 200523 E
Priority Applications (no., kind, date): JP 2001197119 A 20010628; JP
2001157699 A 20010525; JP 2001236376 A 20010803
Patent Details
Number Kind Lan Pg Dwg Filing Notes
GB 2402102 A EN 75 9 Division of application
GB 200212030
2/3/3
DIALOG(R)File 351:Derwent WPI
(c) 2007 The Thomson Corporation. All rts. reserv.
0013017102 - Drawing available
WPI ACC NO: 2003-095697/200309
Related WPI Acc No: 2005-001784; 2005-022879
XRAM Acc No: C2003-024333
XRPX Acc No: N2003-075883
Production of ceramic laminates for electronic parts, involves
forming ceramic green sheet, printing electrically conducting
patterns and ceramic patterns on the green sheet, and
laminating green sheets
Patent Assignee: KYOCERA CORP (KYOC)
Inventor: IWAIDA T; KOIZUMI S
Patent Family (10 patents, 4 countries)
Patent Application
Number Kind Date Number Kind Date Update
GB 2376207 A 20021211 GB 200212030 A 20020524 200309 B
JP 2002353625 A 20021206 JP 2001157699 A 20010525 200310 E
US 20030016484 A1 20030123 US 2002155702 A 20020524 200310 E
JP 2003017356 A 20030117 JP 2001197119 A 20010628 200317 E
JP 2003051675 A 20030221 JP 2001236376 A 20010803 200323 E
CN 1423288 A 20030611 CN 2002130393 A 20020525 200357 E
JP 3527899 B2 20040517 JP 2001197119 A 20010628 200433 E
GB 2376207 B 20050330 200523 E
JP 3726035 B2 20051214 JP 2001157699 A 20010525 200582 E
US 7089659 B2 20060815 US 2002155702 A 20020524 200654 E
Priority Applications (no., kind, date): JP 2001197119 A 20010628; JP
2001157699 A 20010525; JP 2001236376 A 20010803
Patent Details
Number Kind Lan Pg Dwg Filing Notes
GB 2376207 A EN 81 9
JP 2002353625 A JA 9
JP 2003017356 A JA 10
JP 2003051675 A JA 9
JP 3527899 B2 JA 10 Previously issued patent JP 2003017356
JP 3726035 B2 JA 14 Previously issued patent JP 2002353625
|
RELATED HOW DO I...? SOLUTIONS
NEED HELP?
Contact the Dialog Knowledge Center
Within North America +1 800 3 DIALOG (334 2564)
Outside North America 00 800 33 DIALOG (33 34 2564)
Web Form www.dialog.com/contacts/webform
|
You are viewing the
Click below to view the
 |
